METALLIC COATINGS – AN ECONOMICAL ALTERNATIVE
APS Materials, Inc. can apply metallic coatings for specialty applications such as EMI/RFI shielding and heat sink carriers at considerably less cost than traditional methods of application. APS also uses titanium and hydroxyapatite (HA) as implant coatings. These metallic coatings function superbly as synthetic bone substitutes. Each thermal spray process offers unique features and benefits that enhance the functionality of nearly any application.
Medical Implant Coatings
Titanium and hydroxyapatite (HA) are applied as coatings by APS to a variety of medical implants, including finger, hip, vertebrae, shoulder and knee implants, among others. Because of APS’ titanium and hydroxyapatite (HA) coatings, implants now exhibit superior wear-resistance, longer life and greater level of ingrowth between human bone and implant.
Shields & Sputtering Targets
Shield kits, deposition rings and sputtering targets are crucial in the operation of any PVD process. During the deposition of some refractory metals, material builds up on the walls of the chambers and shields, which then begins to flake off at a certain thickness. The results are short operating times and high defect rates.
APS Materials’ robotically-applied twin-wire arc rough coatings feature 2-5 times the surface area versus an uncoated surface and high bond strength to the substrate. The benefits of APS’ process are dramatically increased tool up-time, decreased particle generation and contamination, and an overall lower cost of tool ownership.
EMI/RFI Shielding provides a metallic barrier to protect electronics, such as hand-held electronics and cell phones, against electromagnetic interference and radio frequency interference. APS’ thermal spray technology offers a cost effective method to apply copper or zinc onto the various substrates of these ever-popular items.
Heat Sink Carriers
In the electronics industry, highly advanced chips used in telecommunication devices and PC’s are in increasing need of an improved system of heat dissipation. Diverting heat away from the chip not only protects its life, but increases the performance capability as well. APS’ specialized plasma spray process gives the chips the high thermal conductivity of metal.