High-purity coatings, including yttria and alumina, form durable barriers that protect against corrosion in aggressive plasma conditions. This protection ultimately extends component life, stabilizes etch and deposition environments, and reduces unplanned downtime.
Dense ceramic coatings help prevent flaking, trap loose particles, and maintain structural integrity during repeated plasma cycles. Cleaner component surfaces lead directly to lower defect rates, fewer unscheduled cleans, and more consistent wafer quality.
For components such as electrostatic chucks (ESCs) and RF-exposed surfaces, dielectric coatings are essential. Plasma-sprayed alumina, yttria, or other engineered ceramics provide high breakdown voltage, stable electrical insulation, and reliable performance during thousands of clamp/unclamp cycles.
By preventing chemical attack, erosion, and particle shedding, thermal spray coatings dramatically extend the life of critical semiconductor hardware. Fabs benefit from fewer replacements, fewer PM cycles, and a lower total cost of ownership.
Alumina offers outstanding dielectric strength, thermal stability, and erosion resistance, making it ideal for plasma-exposed semiconductor components. As a plasma spray coating, it provides clean, durable insulation for ESCs, RF hardware, and high-temperature chamber surfaces, improving process stability and reducing contamination risks.
Yttria is an ideal plasma spray coating for fluorine-based etch environments. Its exceptional chemical resistance minimizes erosion, particle generation, and surface degradation within etch chambers and domes. By maintaining surface integrity under aggressive plasma conditions, yttria helps fabs achieve longer component life and more consistent wafer quality.
Alumina-titania coatings combine the electrical insulation of alumina with the added toughness and wear resistance of titania. This engineered blend is well-suited for semiconductor hardware exposed to mechanical abrasion or repeated plasma cycling, offering durable protection, reduced particle shedding, and enhanced reliability in high-duty tool components.
Boron carbide delivers exceptional hardness and superior resistance to high-energy particle erosion, making it a valuable plasma spray coating for semiconductor etch and implant applications. Its low sputter rate and high durability help maintain chamber cleanliness, reduce metal contamination, and provide long-lasting protection in harsh plasma environments.
Yttria-stabilized zirconia offers excellent thermal shock resistance, high-temperature stability, and strong erosion protection, making it effective for semiconductor components exposed to intense heat or plasma bombardment. As a plasma spray coating, YSZ enhances surface durability, minimizes particle generation, and supports consistent performance in demanding process conditions.
Ready to improve process stability and component longevity in your fab? Reach out to our engineering team to explore tailored thermal spray coatings designed for demanding semiconductor manufacturing environments.
Ready to discuss your coating needs? Our engineering team is available to help you find the perfect solution for your application.
